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Magazine Name : Ieee Transactions On Components And Packaging Technologies

Year : 1999 Volume number : 22 Issue: 01

Moisture Ingress Into Organic Laminates (Article)
Subject: Diffusion Coefficient , Equilibrium Moisture Adsorption Mechanism , Moisture Probe
Author: Michael G. Pecht      Haleh Ardebili      Anand A. Shukla     
page:      104 - 110
Effect Of The Interdiffusion Reaction On The Compatibility In Pzt/Pnn Functionally Gradient Piezoelectric Materials (Article)
Subject: Activation Energy , Diffusivity , Distribution , Fgm
Author: Jie Xu      Xinbua Zhu      Zhongyan Meng     
page:      11 - 16
Characterization Of Underfill Materials Foer Functional Solder Bumped Flip Chips On Board Applications (Article)
Subject: Flip Chip , Pcb , Underfill Processing
Author: John H. Lau      Chris Chang     
page:      111 - 119
Low-Frequency Noise In Thick-Film Resistors Due To Two-Step Tunneling Process In Insulator Layer Elemental Mim Cell (Article)
Subject: Low-Frequency , Two-Step Process , Trap
Author: Milan N. Jevtic      Zdravko Stanimirovic      Ivanka Mrak     
page:      120 - 125
Some Aspects Affecting Transmittance Spectra Of Composite Smart Film Wo3 (Article)
Subject: Smart Window , Transmittance , Tungsten Oxide
Author: Ai. Chen      Nengwu Gao      Yongquan Han     
page:      17 - 20
Recent Advances In Plastic Packaging Of Flip Chip And Multichip Modules Mcm Of Microelectronics (Article)
Subject: Encapsulant , Epoxidation , Flip-Chip
Author: C. P. Wong      Michelle M. Wong     
page:      21 - 26
The Net Zero Mass Loss Phenomenon On Opening Switching Contacts With Ac Loading (Article)
Subject: Ac Arc Erosion , Oxide Catalyst , Silver Metal
Author: Jonathan Swingler      John W. Mcbride     
page:      27 - 37
Anode And Cathode Arc Root Movement During Contact Opening At High Current (Article)
Subject: Arc Motion , Contact Mechanics , Current Limiters
Author: John W. Mcbride      Peter A. Jeffery     
page:      38 - 46
Solutions For Fretting Corrosion (Article)
Subject: Contact Resistance , Fretting Fatigue , Friction
Author: Piet Van Dijk      Frank Van Meijl     
page:      47 - 52
Accelerated Testing Of Tin-Plated Copper Alloy Contacts (Article)
Subject: Connectors , Corrosion , Vibration
Author: Robert D. Malucci     
page:      53 - 60
A Simplified Modeling Technique For Finite Element Thermal Analysis Of Plastic Soic Package (Article)
Subject: Ansys , Finite - Element Analysis , Numerical Study , Surface Mounted Rib.
Author: Tony W. C. Mak      Leo G. Feinstein     
page:      6 - 10
Recovery Of Severely Degtaded Tin-Lead Plated Connector Contacts Due To Fretting Corrosion (Article)
Subject: Fretting Fatigue , Gold , Tin
Author: Morton Antler      Aukland Harry      Anna Wehr-Aukland     
page:      61 - 71
Thermal Cycling Induced Wiping Wear Of Connector Contacts At 150 C (Article)
Subject: Automotive Connectors , High Temperature
Author: Chi H. Leung      Anthony Lee     
page:      72 - 78
Self-Assembled Monolayers Of Alkanethiols On Nickel Surfaces For Low Level Electrical Contact Applications (Article)
Subject: Contact Resistance , Electrochemical Reaction , Thiols
Author: Sophie Noel      Frederic Houze      Lionel Boyer     
page:      79 - 84
Electrical Contact Resistance Properties Of Stationary Interfaces (Article)
Subject: Constriction-Size Distribution , Sintering , Electrical Contact
Author: Roland S. Timsit     
page:      85 - 98
Nickel/Palladium Finish For Leadframes (Article)
Subject: Leadframes , Nickel , Palladium
Author: Donald C. Abbott     
page:      99 - 103